By Joe Kelly
That includes precious enter from industry-leading businesses and highly-regarded specialists within the box, this first-of-its type source bargains skilled engineers a accomplished figuring out of the complicated subject matters in RF, SiP (system-in-package), and SoC (system-on-a-chip) construction trying out which are severe to their paintings regarding semiconductor units. The e-book covers key dimension recommendations for semiconductor machine trying out and assists engineers in explaining those ideas to administration to help cut back undertaking fee, time, and assets. according to real-world event and jam-packed with time-saving equations, this in-depth quantity bargains pros sensible info on crucial issues that experience by no means been provided in one reference prior to.
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Additional resources for Advanced Production Testing of RF, SoC, and SiP Devices
References  Agilent Technologies, “S-Parameter Design,” Application Note 154, 2000. html. , and J. Kelly, Production Testing of RF and SoC Devices for Wireless Communications, Norwood, MA: Artech House, 2004. org/wiki/Spectral_mask. pdf. 1 Introduction A lot of changes have been made to the methodologies used for testing for distortion in modern RF-containing SoC devices. Many excellent resources are available describing the types of distortion and how to test them. With the recent integration of RF front ends into SoC transceivers, especially in the area of wireless communications, some changes have been made to the fundamentals of distortion testing.
1 (continued) beginning to emerge in WLAN applications, which play an important role in the SoC market . 4 Testing Receivers The receiver is the portion of a transceiver that takes the incoming RF signal from the antenna all the way down to analog baseband (I and Q). Many of the traditional tests that are performed on LNAs are also performed on receivers. These are items such as gain, NF, IP3, and so forth. However, due to the downconverting architecture of receivers, there is frequency translation of the signal from RF to baseband.
Testing of PAs is necessary to ensure that the signal levels are not too large and are able to be controlled. Common tests on a PA are gain, carrier and image suppression, and sometimes gain flatness, over frequency as well as power level. A PA sometimes has the ability to adjust the gain directly or through the use of a 12 Advanced Production Testing of RF, SoC, and SiP Devices variable attenuator at its output. The most important test to be done on a PA is the adjacent channel leakage ratio (ACLR) test.
Advanced Production Testing of RF, SoC, and SiP Devices by Joe Kelly